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It is a composite board of rigid and flexible substrates. Most rigid substrates are multilayer boards.
Number of Layers: Eight Layers Material: FR-4/Polyimide Board Thickness: FR4: 1.0 +/- 10% PI: 0.05mm Surface Treatment: Electroless Gold Plating 2µ" (min), Ni 100µ" (min) Copper Foil Thickness: 1/H~H/1 oz Remark: Camera Lens
4-layer rigid flex circuit board
Number of Layers: Four Layers Materials: FR4 + Polyimide + Copper Foil + Carbarelay Board Thickness: FR4: 0.8 +/- 0.1mm PI: 0.175mm Surface Treatment: Electroless Gold Plating Au 2µ", Ni 80µ" Copper Foil Thickness: 1/H~H/1 OZ Blind Holes: L1~L2 / L3~L4 Remark: Smartwatch
We also accept prototyping and small lot production of rigid-flex PCBs from AW design at our array.
By combining rigid substrates with bendable flexible substrates, various layouts become possible.
We also accept prototype and small lot production of rigid-flex PCBs from AW design.
By combining rigid substrates with bendable flexible substrates, various layouts become possible.
